Wafer ɗin silicon (Si Wafer)
Menene wafer ɗin silicon?
Wafer ɗin silicon wani sirara ne mai zagaye wanda aka ƙera ta hanyar yankewa, niƙawa, da gogewa da ingots ɗin silicon mai ƙarfi mai tsarki; yana aiki a matsayin babban kayan substrate don kera da'irori masu haɗawa, na'urorin wutar lantarki, na'urori masu auna MEMS, abubuwan photovoltaic da na gani. Halayen lantarki na wafer (resistive, nau'in doping), daidaiton geometric (kauri, TTV, warpage), da ingancin saman (tauri, girman barbashi) kai tsaye suna ƙayyade yawan amfanin ƙasa da daidaiton na'urar a cikin matakai masu zuwa kamar girma na epitaxial, photolithography, da shafi; saboda haka, zaɓi da bin diddigin wafers suna da mahimmanci ga layukan samar da abokin ciniki.
Fayil ɗin samfurin silicon wafer na Semicera Labora ya ƙunshi sassa daban-daban, daga ƙananan wafer substrates zuwa ƙananan substrates masu aiki; yana ba da damar keɓance dabarun girma na lu'ulu'u daban-daban, yanayin yankewa, da mafita na maganin saman bisa ga hanyoyin ƙera ƙasa (epitaxy, oxidation, bonding, MEMS processing).
Playin samfur
Wannan rukuni ya haɗa da ƙananan samfura masu zuwa, kowannensu yana samuwa a cikin takamaiman bayanai:
| Psamfurin | Mfasalulluka na AIN | Aikace-aikace na yau da kullun |
| Layer ɗin silicon mai siriri sosai tare da kauri wanda za'a iya sarrafa shi har zuwa kewayon submicron | Layer na'urar SOI, firikwensin siriri | |
| Babban lanƙwasa na saman–gogewa mai gefe ɗaya ko biyu | MEMS da na'urorin wutar lantarki; ci gaban epitaxial; tabbatar da tsari gabaɗaya | |
| Hanyar CZ–kewayon juriya mai faɗi | Masana'antar IC, na'urori masu rarrabe | |
| Narkewar gundumar (ba tare da ƙwanƙwasa ba), juriya mai yawa, ƙarancin iskar oxygen | Na'urorin lantarki, na'urorin ganowa, aikace-aikacen RF mai yawan mita/mita | |
| SiO da aka girma a saman₂Layer mai rufi mai kauri mai sarrafawa | Layer na warewar MEMS da bincike na capacitor/dielectric |
Bayanan Fasaha na Musamman
Mai zuwa yana lissafa jeri na ƙayyadaddun bayanai na yau da kullun da za a iya gyarawa don samfuran wafer na silicon; ainihin ƙimar suna ƙarƙashin Fom ɗin Tabbatar da Oda:
| Sigogi | Matsakaicin Nisa | Bayyana |
| Diamita na Wafer | 2"-"12"(50–300 mm) | Yana goyan bayan ƙananan zanen samfuri na musamman |
| Yanayin girma na lu'ulu'u | CZ (Hanyar Czochralski) / FZ (Hanyar narkewar yanki) | An tsara FZ don yanayin juriya mai ƙarfi da ƙarancin iskar oxygen. |
| daidaitawar lu'ulu'u | (100)、(111)、(110) | Daidaita da buƙatun tsarin aiki na ƙasa |
| Nau'in shan ƙwayoyi | Nau'in N / Nau'in P | Abubuwan da ke ƙara kuzari: phosphorus, arsenic, boron, da sauransu. |
| juriya | 0.001–10,000Ω·cm | Tsarin FZ yana ba da damar aiki a yankin da ke da juriya sosai. |
| karkacewar kauri | ±10–25 μm (ya danganta da girman) | Yayin da diamita ke ƙaruwa, kauri na yau da kullun yana ƙaruwa daidai gwargwado. |
| Jimlar Bambancin Kauri (TTV) | ≤1–5 μm | Yana shafar zurfin filin photolithography da daidaiton haɗin kai |
| Warp/Bakan | ≤5–20 μm | Manyan takardu suna buƙatar ƙarin matakan sarrafa shafukan yaƙi. |
| Tsaurin saman (Ra) | Sikelin ƙaramin nanometer (fuskar da aka goge) | Yana shafar mannewar siririn fim da aikin lantarki na na'urar |
| sarrafa gefen | Gefen da'ira/Chamfer–ya dace da ƙa'idodin SEMI | Rage fashewa da gurɓatar barbashi da kuma |
| yanayin saman | Gogewa mai gefe ɗaya (SSP)/Gogewa mai gefe biyu (DSP) | DSP ya dace da hanyoyin haɗin kai da ƙera MEMS. |
Lura: Hanyar CZ tana amfani da ma'aunin quartz don haɓaka lu'ulu'u; wannan tsari yana da kyau kuma yana da inganci, amma iskar oxygen da ma'aunin crucible ke gabatarwa yana iyakance ƙimar juriya mafi girma. Sabanin haka, hanyar FZ ba ta amfani da ma'aunin crucible, wanda ke haifar da ƙarancin iskar oxygen sosai kuma yana ba da damar samar da ƙimar juriya mafi girma da daidaito.–yana mai da shi ya dace musamman ga aikace-aikacen da ke da juriya sosai kamar na'urorin wutar lantarki da na'urorin gano abubuwa. Wannan bambanci a cikin hanyoyin masana'antu yana aiki a matsayin babban ma'auni yayin zaɓar kayan aiki ko hanyar ƙera su.
Tsarin Samarwa da Gwaji
Ana gudanar da dukkan tsarin a cikin yanayin daki mai tsafta; ga dukkan muhimman ayyuka, ana kiyaye cikakkun bayanan dubawa don tabbatar da daidaito da kuma bin diddigin sigogi a cikin rukuni-rukuni.
Ayankin aikace-aikace
- •Haɗaɗɗen masana'antar da'ira: A matsayin kayan substrate don na'urorin dabaru na yau da kullun da ƙwaƙwalwar ajiya
- •Na'urorin samar da wutar lantarki: IGBTs, MOSFETs, Schottky diodes, da sauran na'urori masu saurin kamuwa da rashin ƙarfi da kuma ƙarancin lahani.
- •MEMS da Sensors: Yin amfani da wafers masu gogewa masu gefe biyu da wafers masu thermal oxidation don ƙera yadudduka na tsari da keɓewa.
- •Na'urorin RF/Masu Yawan Mita: Abubuwan silicon masu juriya sosai suna rage asarar dielectric, wanda hakan ya sa suka dace da matatun 5G da na'urorin canzawa.
- •Photovoltaics da Optics: A matsayin wani abu mai amfani da shi don amfani da shafi da samfuran tunani na gani
- •Tabbatar da Bincike da Tsarin Aiki: Ƙananan samfuran wafers na musamman don layin samarwa na dakin gwaje-gwaje da ma'aunin gwaji
Me yasa za mu zaɓa?
- Ikon kayan haɗin kai: Kamfanin yana kula da cikakkun layukan samfura waɗanda suka haɗa da murfin silicon carbide (SiC), quartz, graphite, carbon fiber, da samfuran wafer, wanda hakan ke ba shi damar samar da tallafin kayan aiki daga ƙarshe zuwa ƙarshe ga kayan aikin semiconductor da abokan cinikin kera wafer.–maimakon kawai bayar da kayayyakin samfuri daban-daban.
- Musamman samarwa: Ana samun keɓancewa mara daidaituwa bisa ga takamaiman sigogin tsari da abokin ciniki ya bayar (misali, juriya, yanayin lu'ulu'u, kauri, TTV), kuma ana tallafawa ingantaccen samfurin ƙaramin tsari.
- Tsarin Inganci da Ƙarfin Gwaji:Tsarin samarwa yana ƙarƙashin gwaji bisa ga ƙa'idodin SEMI (duk-ko-babu ko bazuwar samfurin ma'auni masu mahimmanci kamar juriya, TTV, warpage, da girman barbashi na saman); ana iya samun cancantar da suka dace da bayanan takaddun shaida akanShafin Cancantar da Daraja.
Tambayoyin da Ake Yawan Yi (FAQ)
T: Ta yaya mutum zai zaɓi tsakanin wafers ɗin silicon na CZ da wafers ɗin silicon na FZ?
A: Ga aikace-aikacen da farashi shine babban abin damuwa kuma buƙatar juriya ta faɗi cikin kewayon ƙasa zuwa matsakaici, wafers ɗin silicon na CZ suna wakiltar zaɓi mafi araha; duk da haka, ga aikace-aikace (misali, na'urorin wutar lantarki masu ƙarfi ko na'urorin ganowa) waɗanda ke buƙatar juriya mai yawa da daidaito tare da ƙarancin iskar oxygen, ana ba da shawarar wafers ɗin silicon na FZ.
T: Menene bambanci tsakanin gogewa mai gefe ɗaya (SSP) da gogewa mai gefe biyu (DSP)?
A: SSP yana da kamannin madubi a gefe ɗaya kawai kuma yana ba da ƙarancin farashi, wanda hakan ya sa ya dace da tsarin epitaxial da photolithography na gargajiya; DSP yana da saman da aka goge a ɓangarorin biyu, yana ba da mafi girman lanƙwasa da ingantaccen tsabtar bayan gida, kuma ana amfani da shi sosai a cikin haɗin gwiwa, aikace-aikacen MEMS, ko hanyoyin da ake buƙatar ƙa'idodi masu tsauri na ingancin bayan gida.
T: Shin sabis ɗin yana tallafawa girma marasa daidaito ko ƙirar samfura na ƙananan rukuni?
A: Tallafi–Ana iya keɓance diamita, kauri, yanayin kristal, da kuma maganin farfajiya bisa ga abokin ciniki'zane ko buƙatun takamaiman bayanai; za a samar da samfuran samfura don tabbatarwa kafin a ci gaba da samar da kayayyaki da yawa.
T: Ta yaya za mu iya tabbatar da ko sigogin wafer sun cika buƙatun layin samarwa?
A: Muna ba da shawarar samar da kewayon juriya mai ma'ana, yanayin lu'ulu'u, juriyar kauri, buƙatun TTV/deflection, da yanayin saman (SSP/DSP); bisa ga waɗannan ƙayyadaddun bayanai, za mu ba da shawarwarin zaɓi da rahoton gwaji.
Nemi Fa'ida da Takardun Fasaha
Don samun ƙiyasin takamaiman takamaiman takaddun silicon wafer, sauke takardar sigogin fasaha na samfurin, ko tattauna hanyoyin da ba na yau da kullun ba, da fatan za a gabatar da buƙatarku ta hanyar"Tuntube Mu",Za mu amsa cikin awanni 24.
