2 ~ 6 inch 4 ° kashe-kwangiyar P-type 4H-SiC substrate

Takaitaccen Bayani:

4 ° kashe-angle P-type 4H-SiC substrate‌ wani takamaiman abu ne na semiconductor, inda "4 ° kashe-kwangiyar" yana nufin kusurwar kusurwar crystal na wafer kasancewa 4 digiri daga kusurwa, kuma "P-type" yana nufin nau'in conductivity na semiconductor. Wannan kayan yana da aikace-aikace masu mahimmanci a cikin masana'antar semiconductor, musamman a cikin filayen lantarki da na'urorin lantarki masu girma.


Cikakken Bayani

Tags samfurin

Semicera's 2 ~ 6 inch 4° kashe-angle P-type 4H-SiC substrates an ƙera su don biyan buƙatun girma na ƙarfin aiki mai girma da masana'antun na'urar RF. Matsakaicin kusurwa na 4° yana tabbatar da ingantacciyar haɓakar epitaxial, yana mai da wannan madaidaicin tushe mai tushe don kewayon na'urorin semiconductor, gami da MOSFETs, IGBTs, da diodes.

Wannan 2 ~ 6 inch 4 ° kashe-angle P-type 4H-SiC substrate yana da kyawawan kaddarorin kayan aiki, gami da haɓakar haɓakar thermal, kyakkyawan aikin lantarki, da ingantaccen kwanciyar hankali na inji. Matsakaicin gefen kusurwa yana taimakawa rage ƙarancin micropipe kuma yana haɓaka yaduddukan epitaxial masu santsi, wanda ke da mahimmanci don haɓaka aiki da amincin na'urar semiconductor na ƙarshe.

Semicera's 2 ~ 6 inch 4° kashe-angle P-type 4H-SiC substrates suna samuwa a cikin nau'ikan diamita, jere daga inci 2 zuwa inci 6, don saduwa da buƙatun masana'antu daban-daban. An ƙera kayan aikin mu daidai don samar da matakan doping iri ɗaya da halaye masu inganci, tabbatar da cewa kowane wafer ya dace da ƙayyadaddun ƙayyadaddun bayanai da ake buƙata don aikace-aikacen lantarki na ci gaba.

Ƙaddamar da Semicera ga ƙirƙira da inganci yana tabbatar da cewa 2 ~ 6 inch 4 ° kashe-angle P-type 4H-SiC substrates isar da daidaiton aiki a cikin kewayon aikace-aikace daga na'urorin lantarki zuwa na'urori masu ƙarfi. Wannan samfurin yana ba da ingantaccen bayani ga ƙarni na gaba na masu amfani da makamashi mai ƙarfi, manyan na'urori masu ƙarfi, tallafawa ci gaban fasaha a cikin masana'antu irin su kera motoci, sadarwa, da makamashi mai sabuntawa.

Ma'auni masu alaƙa da girman

Girman

2-Inci

4-Inci

Diamita 50.8 mm 0.38 mm 100.0 mm + 0/-0.5 mm
Fahimtar Fassara 4° zuwa <11-20>±0.5° 4° zuwa <11-20>±0.5°
Tsawon Fitowa na Farko 16.0mm ± 1.5mm 32.5mm ± 2mm
Tsawon Lantarki na Sakandare 8.0mm ± 1.5mm 18.0mm ± 2 mm
Hannun Filayen Firamare Daidaici <11-20>± 5.0° Parallelto <11-20>± 5.0c
Gabatarwar Flat na Sakandare 90°CW daga farko ± 5.0°, silicon fuska 90°CW daga farko ± 5.0°, silicon fuska
Ƙarshen Sama C-Face: Yaren mutanen Poland na gani, Si-Face: CMP C-Face: OpticalPolish, Si-Face: CMP
Wafar Edge Beveling Beveling
Tashin Lafiya Si-Face Ra <0.2 nm Si-Face Ra <0.2nm
Kauri 350.0± 25.0um 350.0± 25.0um
Polytype 4H 4H
Doping p-Nau'i p-Nau'i

Ma'auni masu alaƙa da girman

Girman

6-Inci
Diamita 150.0 mm + 0/-0.2 mm
Hannun saman 4° zuwa <11-20>±0.5°
Tsawon Fitowa na Farko 47.5mm ± 1.5mm
Tsawon Lantarki na Sakandare Babu
Hannun Filayen Firamare Daidaici zuwa <11-20>±5.0°
Hanya na SakandareFlat 90°CW daga firamare ± 5.0°, silicon fuska
Ƙarshen Sama C-Face: Yaren mutanen Poland na gani, Si-Face:CMP
Wafar Edge Beveling
Tashin Lafiya Si-Face Ra <0.2 nm
Kauri 350.0± 25.0μm
Polytype 4H
Doping p-Nau'i

Raman

2-6 inch 4° kashe-kwangiyar P-type 4H-SiC substrate-3

Lankwasa mai girgiza

2-6 inch 4° kashe-kwangiyar P-type 4H-SiC substrate-4

Ƙaunar ɓarna (KOH etching)

2-6 inch 4° kashe-kwangiyar P-type 4H-SiC substrate-5

KOH hotuna masu ƙyalli

2-6 inch 4° kashe-kwangiyar P-type 4H-SiC substrate-6
SiC wafers

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