Ƙarshen gaba, tsakiya da baya na layin samar da semiconductor
Tsarin masana'anta na semiconductor za a iya kasu kusan zuwa matakai uku:
1) Ƙarshen layin gaba
2) Tsakiyar ƙarshen layi
3) Ƙarshen layi na baya
Za mu iya amfani da kwatanci mai sauƙi kamar gina gida don bincika hadadden tsari na kera guntu:
Ƙarshen gaba na layin samarwa yana kama da aza harsashi da gina bangon gida. A cikin masana'antar semiconductor, wannan matakin ya ƙunshi ƙirƙirar sifofi na asali da transistor akan wafer silicon.
Mahimman Matakan FEOL:
1.Cleaning: Fara da siliki na bakin ciki wafer kuma tsaftace shi don cire duk wani datti.
2.Oxidation: Shuka Layer na silicon dioxide akan wafer don ware sassa daban-daban na guntu.
3. Photolithography: Yi amfani da hoton hoto don tsara alamu akan wafer, kama da zana zane da haske.
4.Etching: Etch away mara so silicon dioxide don bayyana da ake so alamu.
5.Doping: Gabatar da ƙazanta a cikin silicon don canza kayan lantarki, ƙirƙirar transistor, tushen ginin kowane guntu.
Tsakanin Ƙarshen Layi (MEOL): Haɗa ɗigon
Tsakanin ƙarshen layin samarwa yana kama da shigar da wayoyi da famfo a cikin gida. Wannan matakin yana mayar da hankali kan kafa haɗin gwiwa tsakanin transistor da aka kirkira a matakin FEOL.
Mahimman Matakan MEOL:
1.Dielectric Deposition: Deposit insulating layers (wanda ake kira dielectrics) don kare transistor.
2.Contact Formation: Samar da lambobin sadarwa don haɗa transistor zuwa juna da duniyar waje.
3.Interconnect: Ƙara matakan ƙarfe don ƙirƙirar hanyoyi don siginar lantarki, kama da yin amfani da gida don tabbatar da wutar lantarki da bayanai.
Ƙarshen Layi na Baya (BEOL): Ƙarshen Taɓa
Ƙarshen ƙarshen layin samarwa yana kama da ƙara ƙarar ƙarewa zuwa gida - shigar da kayan aiki, zanen, da tabbatar da komai yana aiki. A cikin masana'antar semiconductor, wannan matakin ya ƙunshi ƙara matakan ƙarshe da shirya guntu don marufi.
Mabuɗin Matakan BEOL:
1.Additional Metal Layers: Ƙara nau'i-nau'i na ƙarfe da yawa don haɓaka haɗin kai, tabbatar da guntu na iya ɗaukar ayyuka masu rikitarwa da sauri.
2.Passivation: Aiwatar da matakan kariya don kare guntu daga lalacewar muhalli.
3.Testing: Ba da guntu zuwa gwaji mai tsauri don tabbatar da ya dace da duk ƙayyadaddun bayanai.
4.Dicing: Yanke wafer a cikin kwakwalwan kwamfuta guda ɗaya, kowannensu yana shirye don shiryawa da amfani da na'urorin lantarki.
Semicera shine babban masana'anta na OEM a China, wanda aka sadaukar don samar da ƙimar ta musamman ga abokan cinikinmu. Muna ba da cikakkiyar kewayon samfura da ayyuka masu inganci, gami da:
1.Rahoton da aka ƙayyade na CVD(Epitoxy, al'ada mai rufi CVD sassa, babban aiki mai rufi don aikace-aikacen semiconductor, da ƙari)
2.CVD SiC Bulk Parts(Etch zobba, zoben mayar da hankali, abubuwan SiC na al'ada don kayan aikin semiconductor, da ƙari)
3.Abubuwan da aka Rufe CVD TaC(Epitaxy, SiC wafer girma, aikace-aikacen zafin jiki, da ƙari)
4.Sassan Graphite(Kwale-kwalen zane-zane, kayan aikin graphite na al'ada don sarrafa zafin jiki, da ƙari)
5.SiC Parts(Jirgin ruwa na SiC, bututun murhun SiC, abubuwan haɗin SiC na al'ada don sarrafa kayan haɓaka, da ƙari)
6.Sassan Quartz(Kwayoyin ruwa na Quartz, sassan ma'adini na al'ada don masana'antar semiconductor da masana'antar hasken rana, da ƙari)
Ƙaddamar da ƙaddamar da ƙaddamarwa yana tabbatar da cewa muna samar da sababbin hanyoyin magance masana'antu daban-daban, ciki har da masana'antu na semiconductor, sarrafa kayan haɓaka, da aikace-aikacen fasaha mai zurfi. Tare da mayar da hankali kan daidaito da inganci, an sadaukar da mu don saduwa da bukatun kowane abokin ciniki.
Lokacin aikawa: Dec-09-2024