Nazari a kan semiconductor dietsarin haɗin gwiwa, ciki har da tsarin haɗin gwiwa, tsarin haɗin kai na eutectic, tsari mai laushi mai laushi, tsarin haɗin gwiwa na azurfa, tsarin haɗakarwa mai zafi, tsarin haɗawa guntu. An gabatar da nau'ikan nau'ikan da mahimman alamun fasaha na kayan aikin haɗin gwiwar semiconductor mutu, ana nazarin matsayin ci gaba, kuma ana sa ran yanayin ci gaba.
1 Bayanin masana'antar semiconductor da marufi
Masana'antar semiconductor musamman sun haɗa da kayan aikin semiconductor na sama da kayan aiki, masana'anta na tsakiya, da aikace-aikacen ƙasa. Masana'antar semiconductor na ƙasata ta fara a makare, amma bayan kusan shekaru goma na ci gaba cikin sauri, ƙasata ta zama kasuwa mafi girma na semiconductor na kayan masarufi da kasuwar kayan aikin semiconductor mafi girma a duniya. Masana'antar semiconductor tana haɓaka cikin sauri a cikin yanayin ƙarni na kayan aiki, ƙarni na tsari, da samfuran samfuran. Binciken kan tsari na semiconductor da kayan aiki shine babban ƙarfin tuƙi don ci gaba da ci gaban masana'antu da garantin masana'antu da yawan samar da samfuran semiconductor.
Tarihin ci gaban fasahar marufi na semiconductor shine tarihin ci gaba da haɓaka aikin guntu da ci gaba da ƙarancin tsarin. Ƙarfin tuƙi na ciki na fasahar marufi ya samo asali ne daga fagen manyan wayoyin hannu zuwa fagage irin su na'ura mai ƙarfi da fasaha na wucin gadi. Ana nuna matakai huɗu na haɓaka fasahar marufi na semiconductor a cikin Table 1.
Yayin da nodes ɗin sarrafa lithography na semiconductor ke motsawa zuwa 10nm, 7nm, 5nm, 3nm, da 2nm, R&D da farashin samarwa suna ci gaba da haɓakawa, yawan amfanin ƙasa yana raguwa, kuma Dokar Moore ta ragu. Daga hangen nesa na ci gaban masana'antu, a halin yanzu an ƙuntata ta iyakokin jiki na ƙarancin transistor da babban haɓakar farashin masana'antu, marufi yana haɓakawa a cikin shugabanci na miniaturization, babban yawa, babban aiki, babban sauri, babban mitar, da babban haɗin gwiwa. Masana'antar semiconductor ta shiga zamanin baya-Moore, kuma ci gaba da tafiyar matakai ba a mayar da hankali kawai ga ci gaban fasahar kere kere na wafer ba, amma sannu a hankali suna juyawa zuwa fasahar marufi. Fasahar fakitin ci gaba ba zata iya haɓaka ayyuka kawai da haɓaka ƙimar samfur ba, har ma da rage farashin masana'anta yadda ya kamata, zama hanya mai mahimmanci don ci gaba da Dokar Moore. A gefe ɗaya, ana amfani da fasaha mai mahimmanci don raba hadaddun tsarin zuwa fasahohin marufi da yawa waɗanda za'a iya haɗa su cikin marufi iri-iri da iri-iri. A gefe guda, ana amfani da fasahar tsarin da aka haɗa don haɗa na'urori na kayan aiki da sassa daban-daban, wanda ke da fa'idodin aiki na musamman. Haɗuwa da ayyuka da yawa da na'urori na kayan daban-daban ana samun su ta hanyar amfani da fasaha na microelectronics, kuma ana samun ci gaba daga haɗakarwa zuwa tsarin haɗin gwiwa.
Marufi na Semiconductor shine wurin farawa don samarwa guntu da gada tsakanin duniyar ciki ta guntu da tsarin waje. A halin yanzu, ban da na gargajiya semiconductor marufi da gwaji kamfanoni, semiconductorwaferabubuwan da aka samo asali, kamfanoni masu ƙira na semiconductor, da kamfanonin haɗin gwiwar haɗin gwiwar suna haɓaka ci-gaba marufi ko fasahar marufi masu alaƙa.
Babban matakai na fasahar marufi na gargajiya sunewaferthinning, yanke, mutu bonding, waya bonding, filastik sealing, electroplating, yankan hakarkarinsa da gyare-gyare, da dai sauransu. Daga cikin su, da mutu bonding tsari na daya daga cikin mafi hadaddun da kuma muhimmanci marufi tsarin, da mutu bonding tsari kayan aiki ma daya daga cikin su. mafi mahimmancin kayan aiki mai mahimmanci a cikin marufi na semiconductor, kuma yana ɗaya daga cikin kayan aikin marufi tare da ƙimar kasuwa mafi girma. Kodayake fasahar marufi ta ci gaba tana amfani da matakai na gaba-gaba kamar lithography, etching, metallization, da planarization, mafi mahimmancin tsarin marufi har yanzu shine tsarin haɗin kai.
2 Semiconductor mutu bonding tsari
2.1 Bayani
A mutu bonding tsarin kuma ana kiransa guntu loading, core loading, die bonding, guntu bonding tsari, da dai sauransu. The die bonding tsari da aka nuna a cikin Figure 1. Gabaɗaya magana, mutu bonding shi ne karba guntu daga wafer ta amfani da walda head. bututun tsotsa ta amfani da injin, kuma sanya shi a kan yankin da aka keɓe na firam ɗin gubar ko marufi a ƙarƙashin jagorar gani, ta yadda guntu da kushin suna haɗin gwiwa da gyarawa. Inganci da ingancin tsarin haɗin gwiwar mutu zai shafi kai tsaye da inganci da ingancin haɗin haɗin waya na gaba, don haka mutun haɗin gwiwa ɗaya ne daga cikin mahimman fasahohi a cikin tsarin ƙarshen ƙarshen semiconductor.
Don matakai daban-daban na marufi na samfuran semiconductor, a halin yanzu akwai manyan fasahohin aiwatar da tsarin mutuƙar mutu'a guda shida, wato haɗin gwiwa mai ɗaure, haɗin eutectic, haɗaɗɗiyar solder mai laushi, haɗin haɗin gwiwar azurfa, haɗaɗɗen matsi mai zafi, da haɗaɗɗen guntu-chip. Don cimma kyakkyawar haɗin gwiwar guntu, ya zama dole don sanya mahimman abubuwan aiwatarwa a cikin tsarin haɗin gwiwar mutuwa suyi aiki tare da juna, galibi gami da kayan haɗin gwiwar mutu, zazzabi, lokaci, matsa lamba da sauran abubuwa.
2. 2 Tsarin haɗin gwiwa
A lokacin daɗaɗɗen mannewa, ana buƙatar wasu adadin manne da za a yi amfani da shi a kan firam ɗin gubar ko kunshin kafin a sanya guntu, sannan kuma shugaban haɗin gwiwar mutu ya ɗauki guntu, kuma ta hanyar jagorar hangen nesa na na'ura, ana sanya guntu daidai a kan haɗin gwiwa. matsayi na firam ɗin gubar ko kunshin da aka lulluɓe da manne, kuma ana amfani da wani ƙarfin haɗin gwiwar mutu akan guntu ta kan na'ura mai haɗawa mutu, yana samar da manne tsakanin guntu da firam ɗin gubar ko kunshin substrate, don cimma manufar bonding, installing da kuma gyara guntu. Ana kuma kiran wannan tsarin haɗin gwiwar mutuwa saboda ana buƙatar ɗanɗani a gaban injin ɗin mutuƙar.
Adhesives da aka saba amfani da su sun haɗa da kayan semiconductor kamar guduro epoxy da manna azurfa. Adhesive bonding shi ne mafi yadu amfani semiconductor guntu mutu bonding tsari domin tsari ne in mun gwada da sauki, farashin ne low, kuma iri-iri na kayan za a iya amfani da.
2.3 Eutectic bonding tsari
A lokacin eutectic bonding, eutectic bonding abu gabaɗaya ana riga an yi amfani da shi a ƙasan guntu ko firam ɗin gubar. Kayan aikin haɗin gwiwar eutectic yana ɗaukar guntu kuma tsarin hangen nesa na na'ura yana jagoranta don sanya guntu daidai daidai matsayin haɗin haɗin gwiwa na firam ɗin jagora. Guntu da firam ɗin jagora suna samar da haɗin haɗin eutectic tsakanin guntu da fakitin fakitin ƙarƙashin aikin haɗin gwiwar dumama da matsa lamba. Ana amfani da tsarin haɗin gwiwar eutectic sau da yawa a cikin firam ɗin gubar da marufi na yumbura.
Eutectic bonding kayan gabaɗaya ana haɗe su da kayan biyu a wani zazzabi. Abubuwan da aka fi amfani da su sun haɗa da gwal da tin, zinariya da silicon, da sauransu. Lokacin amfani da tsarin haɗin gwiwar eutectic, tsarin watsa waƙa inda firam ɗin gubar ya kasance zai riga ya zafi firam. Makullin fahimtar tsarin haɗin gwiwar eutectic shine cewa kayan haɗin eutectic na iya narke a yanayin zafi mai nisa a ƙasa da wurin narkewar kayan biyu don samar da haɗin gwiwa. Domin hana firam ɗin daga zama oxidized yayin tsarin haɗin gwiwar eutectic, tsarin haɗin gwiwar eutectic shima yakan yi amfani da iskar gas mai karewa kamar hydrogen da nitrogen gauraye gas don shigar da su cikin hanyar don kare firam ɗin gubar.
2. 4 Soft solder bonding tsari
Lokacin daɗaɗɗen solder mai laushi, kafin sanya guntu, matsayin haɗin kai akan firam ɗin gubar ana tinned da dannawa, ko kuma tined sau biyu, kuma firam ɗin gubar yana buƙatar dumama cikin waƙar. Amfanin tsarin haɗin gwiwar mai laushi mai laushi shine kyakkyawan halayen thermal, kuma rashin amfani shine cewa yana da sauƙin oxidize kuma tsarin yana da rikitarwa. Ya dace da marufi na firam ɗin gubar na na'urorin wuta, kamar fakitin faci transistor.
2. 5 Azurfa sintering bonding tsari
Mafi kyawun tsarin haɗin kai don guntu mai ƙarfi na ƙarni na uku na yanzu shine amfani da fasahar ɓangarorin ƙarfe na ƙarfe, wanda ke haɗa polymers kamar resin epoxy da ke da alhakin haɗi a cikin manne mai ɗaukar hoto. Yana da kyakykyawan kyakykyawan kyamar wutar lantarki, daɗaɗɗen zafin jiki, da halayen sabis na zafin jiki. Hakanan babbar fasaha ce don ƙarin ci gaba a cikin marufi na ƙarni na uku a cikin 'yan shekarun nan.
2.6 Tsarin haɗi na thermocompression
A cikin marufi aikace-aikace na high-yi uku-girma hadedde da'irori, saboda ci gaba da rage guntu interconnect shigarwar / fitarwa farar, kara girma da farar, semiconductor kamfanin Intel ya ƙaddamar da wani thermocompression bonding tsari ga ci-gaba kananan farar bonding aikace-aikace, bonding kankanin. bumps tare da farar 40 zuwa 50 μm ko ma 10 μm. Thermocompression bonding tsari ya dace da guntu-to-wafer da guntu-to-substrate aikace-aikace. A matsayin tsari mai sauri da yawa, tsarin haɗin kai na thermocompression yana fuskantar ƙalubale a cikin lamuran sarrafa tsari, irin su rashin daidaituwar zafin jiki da narkewar ƙarami mai siyar da ƙima. A lokacin haɗin kai na thermocompression, zafin jiki, matsa lamba, matsayi, da sauransu dole ne su cika madaidaicin buƙatun sarrafawa.
2.7 Juya tsarin haɗin gwiwa
An nuna ka'idar tsarin haɗa guntuwar guntu a cikin Hoto 2. Tsarin juyawa yana ɗaukar guntu daga wafer kuma yana jujjuya shi 180° don canja wurin guntu. Bututun kai mai siyar da guntu yana ɗaukar guntu daga injin juzu'i, kuma bugun bugun guntu yana ƙasa. Bayan welding head bututun ƙarfe motsa zuwa saman marufi substrate, shi matsa zuwa ƙasa zuwa bond da kuma gyara guntu a kan marufi substrate.
Fakitin guntuwar guntu fasaha ce ta haɓaka haɗin gwiwar guntu kuma ta zama babban alkiblar ci gaba na fasahar marufi na ci gaba. Yana da halaye na babban yawa, babban aiki, bakin ciki da gajere, kuma yana iya saduwa da buƙatun ci gaba na samfuran lantarki masu amfani kamar wayoyi da Allunan. Tsarin haɗin guntu na juyewa yana sa marufi ya yi ƙasa da ƙasa kuma yana iya gane fakitin guntu da marufi mai girma uku. Ana amfani da shi sosai a cikin filayen fasaha na marufi kamar 2.5D / 3D hadedde marufi, marufi-matakin marufi, da marufi matakin tsarin. Tsarin haɗin gwiwar guntu shi ne mafi yawan amfani da shi kuma mafi yawan amfani da ingantaccen tsarin haɗin kai a cikin fasahar marufi na ci gaba.
Lokacin aikawa: Nuwamba-18-2024