Masu ɗaukar Wafer

Takaitaccen Bayani:

Masu ɗaukar Wafer- Amintattun hanyoyin magance wafer na Semicera, wanda aka ƙera don karewa da jigilar wafers tare da madaidaicin daidaito da aminci a cikin yanayin masana'antu na ci gaba.


Cikakken Bayani

Tags samfurin

Semicera yana gabatar da jagorancin masana'antuMasu ɗaukar Wafer, Injiniya don samar da ingantacciyar kariya da sufuri maras kyau na wafers na semiconductor a cikin matakai daban-daban na tsarin masana'antu. MuMasu ɗaukar Waferan ƙera su sosai don biyan buƙatun ƙirƙira na semiconductor na zamani, tare da tabbatar da kiyaye mutunci da ingancin wafer ɗin ku a kowane lokaci.

 

Mabuɗin fasali:

• Babban Gina Kayan Kaya:An ƙera su daga ingantattun abubuwa masu jurewa da gurɓatawa waɗanda ke ba da tabbacin dorewa da tsawon rai, yana sa su dace da mahalli mai tsabta.

Daidaitaccen Tsara:Yana da madaidaicin daidaitawar ramin da amintattun hanyoyin riko don hana zamewar wafer da lalacewa yayin sarrafawa da sufuri.

Daidaituwar Mahimmanci:Yana ɗaukar nau'ikan girman wafer da kauri, yana ba da sassauci don aikace-aikacen semiconductor iri-iri.

Gudanar da Ergonomic:Ƙirar nauyi mai sauƙi da mai amfani yana sauƙaƙe sauƙi da saukewa, haɓaka aikin aiki da rage lokacin sarrafawa.

Zaɓuɓɓukan da za a iya gyarawa:Yana ba da keɓancewa don biyan takamaiman buƙatu, gami da zaɓin abu, gyare-gyaren girma, da lakabi don ingantacciyar haɗakar aiki.

 

Haɓaka tsarin samar da semiconductor ɗinku tare da Semicera'sMasu ɗaukar Wafer, cikakkiyar mafita don kiyaye wafers ɗinku daga lalacewa da lalacewar injina. Amince da sadaukarwarmu ga inganci da ƙirƙira don isar da samfuran waɗanda ba kawai sun dace ba amma sun ƙetare ka'idodin masana'antu, tabbatar da ayyukan ku suna gudana cikin sauƙi da inganci.

Abubuwa

Production

Bincike

Dummy

Crystal Parameters

Polytype

4H

Kuskuren daidaita yanayin saman

<11-20>4±0.15°

Ma'aunin Wutar Lantarki

Dopant

n-nau'in Nitrogen

Resistivity

0.015-0.025ohm · cm

Ma'aunin injina

Diamita

150.0 ± 0.2mm

Kauri

350± 25 μm

Matsakaicin firamare

[1-100]±5°

Tsawon lebur na farko

47.5 ± 1.5mm

Filayen sakandare

Babu

TTV

≤5m ku

≤10 μm

≤15 μm

LTV

≤3 μm (5mm*5mm)

≤5 μm (5mm*5mm)

≤10 μm (5mm*5mm)

Ruku'u

- 15 μm ~ 15 μm

- 35 μm ~ 35 μm

-45μm ~ 45μm

Warp

≤35 μm

≤45 μm

≤55 μm

Gaba (Si-face) rashin ƙarfi (AFM)

Ra≤0.2nm (5μm*5μm)

Tsarin

Yawan bututu

<1 ya/cm2

<10 a/cm2

<15 ku/cm2

Karfe najasa

≤5E10atoms/cm2

NA

BPD

≤1500 ea/cm2

≤3000 ea/cm2

NA

TSD

≤500 ea/cm2

≤1000 ea/cm2

NA

Ingancin Gaba

Gaba

Si

Ƙarshen saman

Farashin CMP

Barbashi

≤60ea/wafer (size≥0.3μm)

NA

Scratches

≤5ea/mm. Tarin tsayin ≤ Diamita

Tsawon tsayi≤2*Diamita

NA

Bawon lemu/ramuka/tabo/tabo/ fasa/kamuwa

Babu

NA

Gefen kwakwalwan kwamfuta / indents / karaya / hex faranti

Babu

Yankunan polytype

Babu

Tarin yanki≤20%

Tarin yanki≤30%

Alamar Laser ta gaba

Babu

Kyakkyawan Baya

Baya gamawa

C-face CMP

Scratches

≤5ea/mm, Tsawon tarawa≤2* Diamita

NA

Lalacewar baya (guntuwar baki/indents)

Babu

Baƙar fata

Ra≤0.2nm (5μm*5μm)

Alamar Laser na baya

1 mm (daga saman gefen)

Gefen

Gefen

Chamfer

Marufi

Marufi

Epi- shirye tare da marufi

Marufin kaset mai yawa-wafer

* Bayanan kula: "NA" yana nufin babu buƙatar Abubuwan da ba a ambata ba suna iya komawa zuwa SEMI-STD.

tech_1_2_size
SiC wafers

  • Na baya:
  • Na gaba: