Semicera'sWafer CassetteAbu ne mai mahimmanci a cikin tsarin masana'anta na semiconductor, wanda aka ƙera don amintaccen riƙewa da jigilar wafers na semiconductor. TheWafer Cassetteyana ba da kariya ta musamman, tabbatar da cewa kowane wafer an kiyaye shi daga gurɓatacce da lalacewa ta jiki yayin sarrafawa, ajiya, da sufuri.
An gina shi da tsafta mai tsafta, kayan juriyar sinadarai, SemiceraWafer Cassetteyana ba da garantin mafi girman matakan tsabta da dorewa, mahimmanci don kiyaye amincin wafers a kowane mataki na samarwa. Madaidaicin aikin injiniya na waɗannan kaset ɗin yana ba da damar haɗin kai mara kyau tare da tsarin sarrafawa ta atomatik, rage haɗarin kamuwa da cuta da lalacewar inji.
Zane naWafer CassetteHakanan yana goyan bayan mafi kyawun iska da sarrafa zafin jiki, wanda ke da mahimmanci ga hanyoyin da ke buƙatar takamaiman yanayin muhalli. Ko ana amfani dashi a cikin dakuna masu tsabta ko lokacin sarrafa zafi, SemiceraWafer Cassettean ƙera shi don biyan buƙatun masana'antar semiconductor, samar da ingantaccen aiki da daidaito don haɓaka haɓakar masana'antu da ingancin samfur.
| Abubuwa | Production | Bincike | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Kuskuren daidaita yanayin saman | <11-20>4±0.15° | ||
| Ma'aunin Wutar Lantarki | |||
| Dopant | n-nau'in Nitrogen | ||
| Resistivity | 0.015-0.025ohm · cm | ||
| Ma'aunin injina | |||
| Diamita | 150.0 ± 0.2mm | ||
| Kauri | 350± 25 μm | ||
| Matsakaicin firamare | [1-100]±5° | ||
| Tsawon lebur na farko | 47.5 ± 1.5mm | ||
| Filayen sakandare | Babu | ||
| TTV | ≤5m ku | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm (5mm*5mm) | ≤5 μm (5mm*5mm) | ≤10 μm (5mm*5mm) |
| Ruku'u | - 15 μm ~ 15 μm | - 35 μm ~ 35 μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Gaba (Si-face) rashin ƙarfi (AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Tsarin | |||
| Yawan bututu | <1 ya/cm2 | <10 a/cm2 | <15 ku/cm2 |
| Karfe najasa | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Ingancin Gaba | |||
| Gaba | Si | ||
| Ƙarshen saman | Farashin CMP | ||
| Barbashi | ≤60ea/wafer (size≥0.3μm) | NA | |
| Scratches | ≤5ea/mm. Tarin tsayin ≤ Diamita | Tsawon tsayi≤2*Diamita | NA |
| Bawon lemu/ramuka/tabo/tabo/ fasa/kamuwa | Babu | NA | |
| Gefen kwakwalwan kwamfuta / indents / karaya / hex faranti | Babu | ||
| Yankunan polytype | Babu | Tarin yanki≤20% | Tarin yanki≤30% |
| Alamar Laser ta gaba | Babu | ||
| Kyakkyawan Baya | |||
| Baya gamawa | C-face CMP | ||
| Scratches | ≤5ea/mm, Tsawon tarawa≤2* Diamita | NA | |
| Lalacewar baya (guntuwar baki/indents) | Babu | ||
| Baƙar fata | Ra≤0.2nm (5μm*5μm) | ||
| Alamar Laser na baya | 1 mm (daga saman gefen) | ||
| Gefen | |||
| Gefen | Chamfer | ||
| Marufi | |||
| Marufi | Epi- shirye tare da marufi Marufin kaset mai yawa-wafer | ||
| * Bayanan kula: "NA" yana nufin babu buƙatar Abubuwan da ba a ambata ba suna iya komawa zuwa SEMI-STD. | |||
